Cutting
Cutting – using TRUMPF laser-cutting equipment, VANAD and MICROSTEP oxy-acetylene equipment, and MICROSTEP and DIAMS plasma-cutting equipment.
| Lasers machines | Qty. of tables | Dimensions of table (mm) | Max. thickness (mm) |
| TRUMPF L5030 | 2 | 3.000 x 1.500 | 20 |
| TRUMPF L5030 | 2 | 3.000 x 1.500 | 20 |
| TRUMPF L5030 | 2 | 3.000 x 1.500 | 20 |
| TRUMPF L4030 | 2 | 3.000 x 1.500 | 20 |
| TRUMPF L3020 | 2 | 3.000 x 1.500 | 20 |